PN Type Package Designator Pb-Free Packages - Manufacturing Conversion Datecode, Refer to Note 1 Type of Plating / Finish Matte Tin Annealing Process Minimum Plating Thickness Does this Microchip Pb-free device meet RoHS compliance for the following 6 materials: Pb, Hg, Cr6+, Cd, and PBB / PBDE Total Mass (g) STANDARD10L MSOP 3x3mmAll Date CodesMatte Tin150C / 1hr w/l 24 hours400 microinchesYes0.0258
MCP6S93T-E/UN |
RFQ for MCP6S93T-E/UN |
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| Technical/Catalog Information | MCP6S93T-E/UN |
| Vendor | Microchip Technology (VA) |
| Category | Integrated Circuits (ICs) |
| Packaging | Cut Tape (CT) |
| Amplifier Type | Programmable Gain |
| Number of Circuits | 2 - Dual |
| Package / Case | 10-MSOP, Micro10?, 10-uMAX, 10-uSOP |
| Slew Rate | 22 V/s |
| Gain Bandwidth Product | - |
| Current - Supply | 1mA |
| Current - Output / Channel | 25mA |
| Voltage - Supply, Single/Dual (±) | 2.5 V ~ 5.5 V |
| Output Type | Rail-to-Rail |
| -3db Bandwidth | 18MHz |
| Current - Input Bias | 1pA |
| Operating Temperature | -40°C ~ 125°C |
| Voltage - Input Offset | 400V |
| Drawing Number | * |
| Lead Free Status | Lead Free |
| RoHS Status | RoHS Compliant |
| Other Names | MCP6S93T E UN MCP6S93TEUN MCP6S93T E UNCT ND MCP6S93TEUNCTND MCP6S93T-E/UNCT |
| Product | Manufacturers | Pack | D/C | ||||||||
| MCP6S93T-E/UN | - | - | - |